Polycrystalline Diamond Powder

Description: Polycrystalline diamond micro-powder is synthesized by a special directional detonation method. Compared with a single crystal diamond, there are more crystal edges and grinding surfaces, so it has a high removal rate. With self-sharpening and initial stability
Application： Surface polishing of various ceramics and high-end semiconductor materials, grinding and polishing of semiconductor wafers, SiC, and sapphire wafers;
Available sizes：3-7nm to 7/14μm
Classification：：BRM-PD 0-1、BRM-PD 0-2、BRM-PD 1-3~BRM-PD 6-12
Product Catalog： Polycrystalline diamond powder.pdf

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Polycrystalline Diamond Powder Description

Features :

◆ Higher toughness and better selfsharpening properties compared with monocrystalline diamond.

◆ Higher removal rate, less scratches, more consistent polishing performance compared with monocrystalline diamond.

◆ High wear resistance and long service life.

Application：

1. Surface polishing of various ceramics;

2. Applications in the field of high-end semiconductor materials;

3. Used as encapsulation material and magnetic recording system for IT products;

4. Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers;

5. Used as a lubricant or oil additive, it can improve the operational performance of industrial machinery and vehicles, reduce faults and extend service life.

Avaliable Sizes :

Specification	D10(μm)	D50(μm)	D90(μm)
BRM-PD 0-1	≥0.05	0.40-0.60	≤1.00
BRM-PD 0-2	≥0.05	0.90-1.10	≤2.00
BRM-PD 1-3	≥1.00	1.90-2.10	≤3.00
BRM-PD 2-4	≥2.00	2.90-3.10	≤4.00
BRM-PD 3-6	≥3.00	4.40-4.60	≤6.00
BRM-PD 4-8	≥4.00	5.90-6.10	≤8.00
BRM-PD 2-5	≥2.00	7.40-7.60	≤10.00
BRM-PD 5-10	≥5.00	3.40-3.60	≤5.00
BRM-PD 6-12	≥6.00	8.90-9.10	≤12.00